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February 9, 2012
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Analysis Lab  »
pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies ...
False Tin Whiskers: Masquerading Intermetallic
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering ...
Reactions of Sn in the Cu-Sn-Zn Alloy
This paper reports a number of experimentally determined reactions that occur in ...
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Paper aims at analyzing and confirming the reliability performance of embedded components ...
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This paper examines concerns relating to lead-free reflow, PCB degradation, and the ...
Thermal Cycle Testing of PWBs
Paper establishes a test protocol for thermal cycle testing of bare PWBs ...
Void Detection in Solder Balls and Joints
Paper covers an automatic void detection algorithm. The method is applicable to ...
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The head-in-pillow defect has become a relatively common failure since the implementation ...
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Paper discusses an experiment designed to mimic partially activated flux residues under ...
More Analysis Lab  » 		New Standards in Dispensing Technology
New Standards in Dispensing Technology
The new Scorpion can dispense up to 100,000 dots per hour. The ideal dispensing system for flexible and productive dispensing.
Essemtec

Solder Paste Residue Corrosivity Assessment
Solder Paste Residue Corrosivity Assessment
Although SIR and ECM tests are used to evaluate the solder paste residue corrosivity, a more selective method, the Bono test, has been developed.
Authored By:
Céline Puechagut, Anne-Marie Laügt, Emmanuelle Guéné, Richard Anisko
Inventec Performance Chemicals
Bry sur Marne, France
This program first published June 2010
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
 Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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IPC Training & Certification from Blackfox
IPC Training & Certification from Blackfox
 Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
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Lead-free Compatible Selective Soldering
Lead-free Compatible Selective Soldering
 The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
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MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
 Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
 Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
PCB Protection Overview
PCB Protection Overview
 Henkel's circuit board protection include, conformal coating, encapsulants, potting, module sealing and low pressure molding.
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Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
 Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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