Steven Adamson, Market Specialist, Nordson ASYMTEK
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Silicon coating a board has been a standardized process whenever a customer wanted protection from moisture or dust. Lately, we heard it could be detrimental to reliability of solder joints due to CTE mismatch with other materials FR4, ....
Has usage of BGA, bottom termination parts (QFN, SON) increased the risk? These packages are low profile and likely to have less seepage of silicon under them compared to tantalum caps and discrete parts.
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
SMD & through-hole types; others will tally 01005s. A must for inventory control, parts order checking or JIT production. From $389. MOTORIZED or MANUAL. Manncorp
Our guidebook should be helpful to anyone who works with bare boards and board assemblies. Dozens of procedures packed with illustrations. Circuit Technology Center
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule... Blackfox Training Institute
The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility. Juki Automation Systems
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
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Has usage of BGA, bottom termination parts (QFN, SON) increased the risk? These packages are low profile and likely to have less seepage of silicon under them compared to tantalum caps and discrete parts.
Ashok Dhawan, Parker Hannifin Electronic Controls