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May 24, 2013
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Materials Tech
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
Materials Tech
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Board Talk
How to Gauge Solder Paste Volume?
How to Gauge Solder Paste Volume?
Board Talk
Challenges for Step Stencil Printing
Challenges for Step Stencil Printing
Production Floor
PCB Assembly System Set-Up for PoP
PCB Assembly System Set-Up for PoP
Production Floor
Mixed Technology - Which First
Mixed Technology - Which First
Ask the Experts
Revolutionary Printing Solution for SMT Assembly
Revolutionary Printing Solution for SMT Assembly
Production Floor
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Issues with BGA Components Near PCB Edges
Issues with BGA Components Near PCB Edges
What issues are we likely to see when we place BGA components very close to PCB edges?
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
Brian O'Leary, General Manager, Trans-tec America LLC
Steve Hall, President, EKRA America
Bill Coleman, Vice President Technology, Photo Stencil
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Bob Lazzara, VP, Marketing & Tech Support, Circuit Connect, Inc.
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