Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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We use a bench top convection oven for prototype SMD bords. Frequently, on the sides of chip capacitors and resistors there are solder balls that must be hand removed. What's causing these to form? Also, at room temperature storage, what is the practical shelf life of a syringe of solder paste, and what symptoms would one see when the syringe is getting too old?
Don Patterson, Louisiana State University
In 2D Xray, the QFN leads look like flat strips with a dark toe. The toe is where excess solder is. The thermal pad in the center has large voids. The joint is hidden and 2D Xray is our only available tool. Can you advise further how we can judge the quality of these joints?
Phil and Jim, great talk and good advise! We made a study with one of our customers regarding the best pad design for automatic X-ray inspection of QFN solder joints. Feel free to contact Viscom for details!
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Don Patterson, Louisiana State University
Ashok Dhawan, Parker Hannifin Electronic Controls, Canada
Carsten Salewski, Viscom Inc.