Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Situation: In house repair facility for boards from various vendors. A board may bear a ROHS label, but the lead free solder alloy is not known.
What is the best rework procedure? Clean off original solder residue first, or just use any lead free alloy and not worry about the resulting mix?
Julius Madey, NY State Thruway Authority
In your "board talk" concerning repairing lead-free joints with tin-lead, I believe you said, in-part, "If the board is used in a high stress environment then the tin-lead is more reliable but if its a low-stress environment then the lead free repair is more reliable".
If I heard you correctly, could you educate me briefly as to why? I would have thought the repair best suited for a high-stress environment would always be more reliable in any situation. What am I missing here?
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Use the form below to submit a comment.
What is the best rework procedure? Clean off original solder residue first, or just use any lead free alloy and not worry about the resulting mix?
Julius Madey, NY State Thruway Authority
If I heard you correctly, could you educate me briefly as to why? I would have thought the repair best suited for a high-stress environment would always be more reliable in any situation. What am I missing here?
Brent Sorensen, Universal Synaptics