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June 19, 2013
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Analysis Lab
White Discoloration After Ultrasonic Cleaning
White Discoloration After Ultrasonic Cleaning
Ask the Experts
Results with Benchtop PCB Cleaning
Results with Benchtop PCB Cleaning
Production Floor
Oscillating Nozzles for Improved Cleaning
Oscillating Nozzles for Improved Cleaning
Production Floor
Collaborative Cleaning Innovations
Collaborative Cleaning Innovations
Production Floor
Cleaning Conformal Coating After Rework
Cleaning Conformal Coating After Rework
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Proper DI Water Resistivity for PCB Cleaning?
Proper DI Water Resistivity for PCB Cleaning?
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Can Water Harm Electronic Components?
Can Water Harm Electronic Components?
Board Talk
Cleaning to Enhance Product Reliability
Cleaning to Enhance Product Reliability
Production Floor
Mixed Cleaning - No Clean and Water Soluble
Mixed Cleaning - No Clean and Water Soluble
Board Talk
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SMT Component Lead Oxidation
SMT Component Lead Oxidation
How can we remove oxidation from SMT component leads? The component leads are oxidized due to long time storage.
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Sandip Thakor, Quality Engineer, Matrix Telecom Solution P Ltd
Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Steven Adamson, Market Specialist, Nordson ASYMTEK
Mark McMeen, VP Engineering Services, STI Electronics Inc.
Alan Cable, President, ACE Production Technologies
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