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PCB Protection Overview
Henkel's circuit board protection include, conformal coating, encapsulants, potting, module sealing and low pressure molding.
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Challenges of Package on Package Devices
Paper outlines the process associated with soldering stacked packages using dip flux and dip solder paste designed to overcome the incidence of package warp.
Authored By:
Bob Willis
ASKbobwillis.com
Chelmsford, Essex, United Kingdom
David Bernard
Nordson DAGE
Fremont, CA, USA
This program first published April 2010
Materials Tech programs cover topics including: Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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IPC Member Spotlight »
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
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Featured Sponsors »
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Compact Reflow Oven with KIC
Space-saving 6 1/2 ft. long, 16" pin conveyor over 20" mesh belt. Computer-controlled, four convection heat zones, lead-free. Includes KIC "Auto Focus Power". $22,995 · CR-4000C INFO
Manncorp
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The Component Rework Experts
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Circuit Technology Center
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A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
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IPC Training & Certification from Blackfox
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
Blackfox Training Institute
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Lead-free Compatible Selective Soldering
The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
Juki Automation Systems
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MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
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