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February 9, 2012
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Challenges of Package on Package Devices
Challenges of Package on Package Devices
Paper outlines the process associated with soldering stacked packages using dip flux and dip solder paste designed to overcome the incidence of package warp.
Authored By:
Bob Willis
ASKbobwillis.com
Chelmsford, Essex, United Kingdom

David Bernard
Nordson DAGE
Fremont, CA, USA
This program first published April 2010
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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