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May 24, 2013
Cause of SMT Component Shift?
Cause of SMT Component Shift?
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Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
Board Talk
What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
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Tombstoning Dilemma
Tombstoning Dilemma
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Adding Weights to Small BGAs During Reflow
Adding Weights to Small BGAs During Reflow
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Effect of Cooling Rate on the Intermetallic Solder Joints
Effect of Cooling Rate on the Intermetallic Solder Joints
Production Floor
How to Re-Certify a Reflow Oven After Moving
How to Re-Certify a Reflow Oven After Moving
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Effects of Reflow and Flux on Tin Whiskers
Effects of Reflow and Flux on Tin Whiskers
Analysis Lab
Why LGA/QFN Packages May Float During Reflow
Why LGA/QFN Packages May Float During Reflow
Production Floor
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Micro Solder Balls Problem
Micro Solder Balls Problem
We're using a lead-free HASL circuit board with a SAC alloy and a RoHS reflow process using nitrogen. We are generating micro solder balls.
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Expert Panel contributors for this topic:
Mike Scimeca, President, FCT Assembly
Al Cabral, Product Development Manager, VJ Technologies, Inc.
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Gregory Arslanian, Global Segment Manager, Air Products & Chemicals, Inc.
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Solder spatter (solder splash) is an interesting phenomenon that can be exacerbated by low ppm O2 levels (i.e. in nitrogen reflow). See a discussion at: http://blogs.indium.com/blog/semiconductor-and-power-semi-assembly/0/0/solderspatter-solder-paste-in-unexpected-places

Andy C Mackie, Indium Corporation



Remember that solder under the chip's edge after placement is shadowed so it heats up slower and can result in an "island" of solder that pools up on the solder mask if the unshadowed solder melts quickly and pulls away. Make sure your screen apertures are designed so that when the paste is squeezed down, shadowed solder is minimized. Also, make sure the screen bottom is super cleaned between applications.

James McGrath, Lockheed Martin

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