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December 22, 2014
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
What is Causing Intermittent BGA Failures?
What is Causing Intermittent BGA Failures?
Board Talk
Evaluating Accuracy of Thermocouple Attach Methods
Evaluating Accuracy of Thermocouple Attach Methods
Analysis Lab
Opens at BGA Component Corner Balls
Opens at BGA Component Corner Balls
Ask the Experts
Solderability Problems at Low Humidity
Solderability Problems at Low Humidity
Board Talk
Lead-Free Profile Using Leaded Paste
Lead-Free Profile Using Leaded Paste
Ask the Experts
Rechecking Thermal Profiles
Rechecking Thermal Profiles
Ask the Experts
Reflow Optimization for MLP Components
Reflow Optimization for MLP Components
Production Floor
Lead-free Reflow Oven Zone Count
Lead-free Reflow Oven Zone Count
Ask the Experts
Reflow For Rigid Flex
Reflow For Rigid Flex
Board Talk
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Slope Calculation for Reflow Oven Profiles
Slope Calculation for Reflow Oven Profiles
Is there a specification for the time period to calculate the slope for a reflow oven profile?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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