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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
April 18, 2014
Lead-free Reflow and Influence of Moisture
Lead-free Reflow and Influence of Moisture
Analysis Lab
Pin-in-Paste Calculations
Pin-in-Paste Calculations
Board Talk
What Causes Chip Blow Off During Reflow?
What Causes Chip Blow Off During Reflow?
Board Talk
LGA/QFN Packages Floating During Reflow
LGA/QFN Packages Floating During Reflow
Analysis Lab
Why Do Our Boards Warp During Reflow?
Why Do Our Boards Warp During Reflow?
Board Talk
Vapor Phase Quality Improvement
Vapor Phase Quality Improvement
Production Floor
Tips When Moving a Reflow Oven
Tips When Moving a Reflow Oven
Board Talk
Solder Bridging on BGAs
Solder Bridging on BGAs
Ask the Experts
Void-Free Soldering With Vapor-Phase Vacuum Tech
Void-Free Soldering With Vapor-Phase Vacuum Tech
Production Floor
How Many Zones Needed for Lead-free Profile?
How Many Zones Needed for Lead-free Profile?
Ask the Experts
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Select the best plastic for DDR4 housings
Select the best plastic for DDR4 housings
DSM presents a benchmark between various high performance materials for DDR4 housings. Download the paper and select the best material for DDR4.
DSM Engineering Plastics B.V.

Slope Calculation for Reflow Oven Profiles
Slope Calculation for Reflow Oven Profiles
Is there a specification for the time period to calculate the slope for a reflow oven profile?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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