IPC OUTLOOK Logo
The Knowledge and Know-how Connection
IPC OUTLOOK Logo
May 22, 2013
Cause of SMT Component Shift?
Cause of SMT Component Shift?
Ask the Experts
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
Board Talk
What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
Board Talk
Tombstoning Dilemma
Tombstoning Dilemma
Ask the Experts
Adding Weights to Small BGAs During Reflow
Adding Weights to Small BGAs During Reflow
Ask the Experts
Effect of Cooling Rate on the Intermetallic Solder Joints
Effect of Cooling Rate on the Intermetallic Solder Joints
Production Floor
How to Re-Certify a Reflow Oven After Moving
How to Re-Certify a Reflow Oven After Moving
Ask the Experts
Effects of Reflow and Flux on Tin Whiskers
Effects of Reflow and Flux on Tin Whiskers
Analysis Lab
Why LGA/QFN Packages May Float During Reflow
Why LGA/QFN Packages May Float During Reflow
Production Floor
More Related Programs  »
Featured Sponsor - please stay tuned ...   »
Custom Epoxy Formulations for Enhanced Performance
Custom Epoxy Formulations for Enhanced Performance
Master Bond custom formulations are designed for enhanced performance upon exposure to harsh environmental conditions. Learn more at Masterbond.
Master Bond Inc.

Slope Calculation for Reflow Oven Profiles
Slope Calculation for Reflow Oven Profiles
Is there a specification for the time period to calculate the slope for a reflow oven profile?
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  » Submit a Comment  »

No comments have been submitted.
Sponsors   »
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships
Programs: 900+  |  Directory Listings: 1450+  |  IPC Members: 3100+
Subscribers: 100,000+


Views: 2850