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May 24, 2013
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Materials Tech
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
Materials Tech
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Board Talk
How to Gauge Solder Paste Volume?
How to Gauge Solder Paste Volume?
Board Talk
Challenges for Step Stencil Printing
Challenges for Step Stencil Printing
Production Floor
PCB Assembly System Set-Up for PoP
PCB Assembly System Set-Up for PoP
Production Floor
Mixed Technology - Which First
Mixed Technology - Which First
Ask the Experts
Revolutionary Printing Solution for SMT Assembly
Revolutionary Printing Solution for SMT Assembly
Production Floor
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Benefits of Electrolytic Solder
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The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
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Are There Standards Governing Polarity Marks?
Are There Standards Governing Polarity Marks?
Is there a standard that governs how polarity marks are used to denote orientation of components on circuit boards?
Comments  » Submit a Comment  »


Anode Cathode pin1 these should not be a issue. There are rules for thru hole and you can carry them over to SMT. As in when learning about thru hole Diodes you learn a saying Cathy lives at the bar, meaning the bar shown on the Diode is the Cathode. When building this part I always make the cathode pin one. SMT or thru hole. The parts 0 orientation always matches the tape and reel. This is not rocket since but it does take formal requirements to be followed. Keep your standard rules and you should always be placed correctly.

Dave Pavone



I'm currently chairman of the Automated Component Handling Committee of the ECA/EIA, and we publish the EIA-481 standard for carrier tape. This issue of non-standard or no-standard marking for polarity or Pin 1 location has caused nothing but headaches for us.

We've done our best to establish standard rules for component orientation in tape, but our efforts have been hampered by the inconsistent markings by manufacturers and legacy orientation practices dating to the beginnings of SMT. Would one of you, Jim or Phil, be willing to contribute your thoughts on this matter to our committee?


Scott Carter, Tek Pak, Inc., US

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