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Accuracy of Pick & Place System Ratings
For estimating equipment capacity, why can't we use the Pick and Place manufacturer's rating for components per hour?
Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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The IPC has attempted to shed light on this topic by introducing the IPC-9850 standard a few years ago. What many people don't realize is that the 50+ page standard is more than just a method for leveling the playing field when it comes to placement rates.
The standard goes into defining the methods for determining other performance characteristics such as throughput (not to be confused with placement rate), reliability and accuracy. Most people know only of the placement rate portion of this standard as this is what most pick and place manufacturers publish in their specifications.
Most only know of the placement rate associated with the 0603 placement pattern as this generally yields the highest placement rates. While this pattern varies the spacing and placement orientation of the components in an "attempt" to level the playing field, it is still not going to provide a means for comparing placement machines when it comes to typical SMT assemblies.
There is only one way to know which machine will perform best on any given assembly and that is to have the pick and place manufacturer do a test with actual board in question and then guarantee the placement rate. That said, the fastest rated machine may not perform best overall because with today's lower volumes and more frequent changeovers, in many cases the tortoise beats the hare.
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Use the form below to submit a comment.
The standard goes into defining the methods for determining other performance characteristics such as throughput (not to be confused with placement rate), reliability and accuracy. Most people know only of the placement rate portion of this standard as this is what most pick and place manufacturers publish in their specifications.
Most only know of the placement rate associated with the 0603 placement pattern as this generally yields the highest placement rates. While this pattern varies the spacing and placement orientation of the components in an "attempt" to level the playing field, it is still not going to provide a means for comparing placement machines when it comes to typical SMT assemblies.
There is only one way to know which machine will perform best on any given assembly and that is to have the pick and place manufacturer do a test with actual board in question and then guarantee the placement rate. That said, the fastest rated machine may not perform best overall because with today's lower volumes and more frequent changeovers, in many cases the tortoise beats the hare.
Greg Pompea