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February 10, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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Component Damage From IR Reflow
Component Damage From IR Reflow
We have an SMT package with J formed leads that crack at the shoulder after IR reflow. What could be causing these defects?
This program first published January 2010
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Terry Munson, President/Senior Technical Consultant, Foresite
John Vivari, Application Engineering Supervisor, Nordson EFD
Dr. Brian Toleno, Application Engineering, Henkel Electronics
Steven Adamson, Market Specialist, Nordson ASYMTEK
Bjorn Dahle, President, KIC
Michael Ray, President, Integrated Ideas & Technologies, Inc.
Kris Roberson, Manager of Assembly Technology, IPC
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