IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 10, 2012
Improve Scheduling in Electronics Assembly
Supply Chain
Solder Paste and the 5 Ball Rule
Board Talk
Past, Present, Future of Solderless Assembly
Production Floor
Optimization to Prevent the Graping Effect
Production Floor
Stencil Manufacturing and Impact on Precision
Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Ask the Experts
A Robust Fine Feature Printing Process
Production Floor
When Is It Time to Replace a Squeegee or Stencil?
Board Talk
Pick and Place to Insert Radial Lead Devices
Board Talk
Optimizing Print Process for Mixed Technology
Production Floor
More Related Programs  »



Solderability Problems at Low Humidity
Can very low humidity effect solderability of PCB assemblies. Are there other ...
Cleaning Reballed BGA Components
We currently clean reballed BGA components using an ultrasonic cleaner followed by ...
Shelf Life Before Conformal Coating
Prior to conformal coating, how long can we keep a circuit board ...
Solder Paste and the 5 Ball Rule
For either Type III or Type IV solder paste, should there be ...
The Demise of the Plated-Through Hole?
How long do you expect the industry will continue to use through ...
Problems With Wave Solder Lead Bridging
We are wave soldering very close pitch through-hole components and see bridging. ...
Removal of Oxidation from Bare PCBs
What would be the best method or product for cleaning bare PCBs ...
Is Baking Required After Water Cleaning?
Do circuit board assemblies need to be baked after routine aqueous cleaning? ...
Poor Wetting On OSP Coated PCBs
We are experiencing poor wetting on one OSP coated PCB using a ...
What is the Shelf Life of Solder Paste?
What is the practical shelf life of a syringe of solder paste, ...
More Board Talk  »
New Standards in Dispensing Technology
New Standards in Dispensing Technology
The new Scorpion can dispense up to 100,000 dots per hour. The ideal dispensing system for flexible and productive dispensing.
Essemtec

Components Near PCB Edges
Components Near PCB Edges
What issues are we likely to see whan we place BGA components very close to PCB edges? What impact might it have on reliability?
This program first published January 2010
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Components Near PCB Edges

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
Featured Sponsors  »
Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America
Circuit Board Repair and Rework Specialists
Circuit Board Repair and Rework Specialists
Circuit Technology Center continues to be recognized as the most innovative specialist in circuit board repair and rework. Learn why.
Circuit Technology Center
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic image
Flux and Under-fill in a Single Material
Flux and Under-fill in a Single Material
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
Henkel Corporation
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships