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May 24, 2013
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Materials Tech
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
Materials Tech
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Board Talk
How to Gauge Solder Paste Volume?
How to Gauge Solder Paste Volume?
Board Talk
Challenges for Step Stencil Printing
Challenges for Step Stencil Printing
Production Floor
PCB Assembly System Set-Up for PoP
PCB Assembly System Set-Up for PoP
Production Floor
Mixed Technology - Which First
Mixed Technology - Which First
Ask the Experts
Revolutionary Printing Solution for SMT Assembly
Revolutionary Printing Solution for SMT Assembly
Production Floor
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Components Near PCB Edges
Components Near PCB Edges
What issues are we likely to see whan we place BGA components very close to PCB edges? What impact might it have on reliability?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  » Submit a Comment  »


Placing components out to the edge of the PCB can be done with the use of SMT pallets. SMT pallets are designed to nest and secure odd shaped, very thin, or similarly "challenged" PCB designs from screen print through reflow, and could definitely solve this problem.

Ken Daniels, Zhone Technologies

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