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February 10, 2012
Solderability Problems at Low Humidity
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Solder Deposits During Wave Soldering
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Design of New Solder Attach Technologies
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Problems Hand Soldering 24 Layer Board
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Nitrogen Inerting For Lead-Free Wave Soldering
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Problems With Wave Solder Lead Bridging
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Wave Soldering Problems
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Hand Soldering vs. Selective Wave
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Problems with Blow Holes
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BGA Processing for Reliability
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Components Lifting During Wave Soldering
Components Lifting During Wave Soldering
How can we prevent through hole components from lifting or tilting during the wave solder process; weighted bean bags, chain mail, glue spray?
This program first published January 2010
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.
We use a small dab of crazy glue to hold parts in place and it works very well.

J N, Reliable Controls Corp.
We have begun rotating PCBs in our wave pallets from 15 to 45 degrees. The main reason is to decrease bridging. However, we've noticed a dramatic decrease in lifting and tilting. My guess is that lifting forces are acting on component leads in a successive fashion rather than simultaneously, and the components' weight can better oppose those lifting forces.

Ken Daniels, Zhone Technologies
You can use wave pallets with a "top catch" which is a top spring loaded pin support for each parts. This will solve your problem.

Shrikant Borkar, GIC
You mentioned cut and clinch machines but neglected to mention that there is a very popular semi-automatic cut and clich machine still being manufactured. The Contact Sytems CS-400E machine not only cuts and cliches the leads, it also uses beams of light to guide the operator to the correct insertion location.

The cut and clinch parameters (lead length and clinch angle) are fully programmable which makes the machine a great solution for mixed technology boards. With this type of machine lead forming is greatly simplified (and for many components not required).


Greg Pompea, Versatec
We have had success tacking (by hand soldering) the component with high temperature solder (Sn10Pb88Ag02) prior to going over the wave.

Bruce J. Sander, ITT Electronic Systems
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Components Lifting During Wave Soldering

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