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The Knowledge and Know-how Connection
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May 22, 2013
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Views: 3116
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We have adopted the use of a Ultrasonic Process which contains a small % (~ 2 to 5% ) of a saponifier with DI water. We clean the boards with the mis-printed portion of the board in the solution. We do not allow the solution to go over the top only touch the surface that has been mis-printed thus allow the metal to fall to the bottom of the tank.
We run the ultrasonic for 4 minutes at 35degrees, then Water Wash using a batch Centrifuge system for 15 minutes then 15 minutes in a Vacuum bake. When all said and done the boards is good to go back in to the process.
Ray Whittier, Sr.SMT Process Engineer, Vicor Corporation - VI Chip Division
Please dont wipe down boards prior to misprint, the powder will simply be forced into holes and wells on the circuit, thus having to wash the PCB much longer, and subjecting the solder mask to longer immersion times in the stencil cleaner. If the mask is undercured this will be detrimental to the resist.
Greg York, BLT Circuit Services Ltd