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February 8, 2012
Improve Scheduling in Electronics Assembly
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Solder Paste and the 5 Ball Rule
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Past, Present, Future of Solderless Assembly
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Optimization to Prevent the Graping Effect
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Stencil Manufacturing and Impact on Precision
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Plating Lead-free Parts for Tin/Lead Assembly
Ask the Experts
A Robust Fine Feature Printing Process
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When Is It Time to Replace a Squeegee or Stencil?
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Pick and Place to Insert Radial Lead Devices
Board Talk
Optimizing Print Process for Mixed Technology
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How To Determine Stencil Thickness
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On what basis is stencil thickness decided in the case of BGA's or fine pitch components?
This program first published January 2010
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
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Comments  »
Use the form below to submit a comment.
We have converted IPC 7525 for stencil thickness determination into a regression equation. Stencil Thickness = 2.64 + 0.0831 * pitch of component. Take average of all stencil thickness derived for all components, if min. to max. difference is more than 2mil, consider a step-up/step-down stencil in selective locations.

subrat, Larsen Toubro Ltd., India
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How To Determine Stencil Thickness

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