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February 10, 2012
Solderability Problems at Low Humidity
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Solder Deposits During Wave Soldering
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Design of New Solder Attach Technologies
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Problems Hand Soldering 24 Layer Board
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Nitrogen Inerting For Lead-Free Wave Soldering
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Problems With Wave Solder Lead Bridging
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Hand Soldering vs. Selective Wave
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The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
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Idle Time Between Soldering and Cleaning
Idle Time Between Soldering and Cleaning
After soldering components to a pcb, are there specific time intervals between the soldering process and the cleaning process?
Authored By:
Terry Munson
President/Senior Technical Consultant
Foresite

John Vivari
Application Engineering Supervisor
EFD, Inc.

Steven Adamson
Market Manager
Asymtek
This program first published December 2009
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Terry Munson, President/Senior Technical Consultant, Foresite
John Vivari, Application Engineering Supervisor, Nordson EFD
Steven Adamson, Market Specialist, Nordson ASYMTEK
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