Ken Bliss, President & CEO, Bliss Industries, Inc.
James Mahoney, Applications Project Manager, Quick Turn Flex Circuits LLC
Prashant Joshi, Director of Engineering, Interconnect Systems Inc.
Don Naugler, General Manager, VJ Technologies, Inc.
Mark McMeen, VP Engineering Services, STI Electronics Inc.
Neil O'Brien, Sales Director, Finetech
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I recommend that all assemblies be preheated and to use a hot air pencil to remove the components that need to be removed. When you do not preheat the assembly you are thermally shocking the component and surrounding components and the board assembly in general. If you do not preheat you are cutting corners. I have seen ceramic components crack because of thermal shock. I have seen glass seals crack from thermal shock.
Chuck Erbe
If the rework is concentrated on removing and replacing MSD such as BGAS and CSPs, baking the populated board is necessary in order to eliminate the moisture presence on the assembled board.
This is clearly defined and reflected on topic#6 of IPC/Jedec J-STD-033A (Handling, Packing, Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices). However, it is important that the appropriate bake duration for the PCBA and the component to be reworked is considered as per table 4-1 since some PCBs and MSD parts are sensitive to baking.
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Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
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Chuck Erbe
This is clearly defined and reflected on topic#6 of IPC/Jedec J-STD-033A (Handling, Packing, Shipping and Use of Moisture Reflow Sensitive Surface Mount Devices). However, it is important that the appropriate bake duration for the PCBA and the component to be reworked is considered as per table 4-1 since some PCBs and MSD parts are sensitive to baking.
Manolito Mapaye, Venture Manufacturing Services