Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
Do We Still Need SMT Adhesives?
If double sided surface mount assemblies are the way of the future, should we anticipate a growing or declining need for SMT adhesives?
Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments» Use the form below to submit a comment.
I have a hot air machine which I use for most of my assembly work. I recently have had to build a double sided board which has 2 IC's, one on each side and they both have a center ground plane which covers the majority of the package.
The problem I have had is, after placing down the smaller IC and turning the board over to place the larger IC, the smaller IC is dropping to some degree and loosing some contact with the pins and center ground. I have switched to do the larger component first then turn the board over and do the smaller IC. Same results are happening.
I have taped the first IC into place after soldering it down and turning the board using Kapton tape and it still slides around when placing the second IC on the board. I have never worked with any of the bonding material and am wondering whether this will take care of my issues.
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
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The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market. Juki Automation Systems, Inc.
Use the form below to submit a comment.
The problem I have had is, after placing down the smaller IC and turning the board over to place the larger IC, the smaller IC is dropping to some degree and loosing some contact with the pins and center ground. I have switched to do the larger component first then turn the board over and do the smaller IC. Same results are happening.
I have taped the first IC into place after soldering it down and turning the board using Kapton tape and it still slides around when placing the second IC on the board. I have never worked with any of the bonding material and am wondering whether this will take care of my issues.
Mary Shughart, Atmel Corporation