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February 10, 2012
Solderability Problems at Low Humidity
Board Talk
Solder Deposits During Wave Soldering
Ask the Experts
Design of New Solder Attach Technologies
Materials Tech
Problems Hand Soldering 24 Layer Board
Ask the Experts
Nitrogen Inerting For Lead-Free Wave Soldering
Production Floor
Problems With Wave Solder Lead Bridging
Board Talk
Wave Soldering Problems
Ask the Experts
Hand Soldering vs. Selective Wave
Ask the Experts
Problems with Blow Holes
Ask the Experts
BGA Processing for Reliability
Production Floor
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Copper Dissolution in Lead-Free Alloys
Copper Dissolution in Lead-Free Alloys
This paper discusses a test method that characterizes the dissolution rate of copper from PWBs. The performances of many alloys were compared at three temperatures.
Authored By:
Christopher Hunt, Davide Di Maio
National Physical Laboratory
This program first published September 2009
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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