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February 10, 2012
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Board Performance after Pb-Free Reflow
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This paper will focus on air-air thermal cycling, IST testing and material survivability after lead-free assembly reflow.
Authored By:
Joe Smetana, Alcatel-Lucent
Thilo Sack, Celestica
Wayne Rothschild, IBM
Bill Birch, PWB Interconnect Solutions
Kim Morton, Viasystems
This program first published September 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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5,000 cph Placer is under $50k
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