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The Knowledge and Know-how Connection
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May 24, 2013
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Comparison of SAC105 and SAC305 Solders
In this paper, the thermal fatigue performance under accelerated test conditions is compared for three common BGA ball alloys.
Authored By:
Gregory Henshall, Hewlett-Packard Co.
Jasbir Bath, Bath Technical Consultancy
Sundar Sethuraman, Jabil
David Geiger, Flextronics International
Ahmer Syed, Amkor
M.J. Lee, Xilinx
Keith Newman and Livia Hu, Sun Microsystems
Dong Hyun Kim and Weidong Xie, Cisco Systems
Wade Eagar and Jack Waldvogel, Motorola
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