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February 3, 2012
Reactions of Sn in the Cu-Sn-Zn Alloy
Analysis Lab
Next Generation PoP Pastes
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The Digital Solder Paste
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Thermal Shock/Drop Test of Lead-free
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Lead-free Development in Server Applications
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What is the Shelf Life of Solder Paste?
Board Talk
Comparison of SAC105 and SAC305 Solders
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Solder Pastes to Reduce Head-In-Pillow
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Lead-free Development in Server Applications
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions that affect solder attach attributes.
Authored By:
L. G. Pymento, W.T. Davis
IBM

Ben Kim
Surangkana Umpo
Celestica
This program first published September 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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