Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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At one time we used Alpha 6100 series no clean. It had a very long stencil life and it never dried to a hard crusty material. You could place "Late Parts" a couple days later and things would solder OK.
The big problem was cleaning a board after rework, you can not remove the no clean flux, it makes a mess. So we gave up and used WS, late parts became hand soldered parts.
Is there anything out there that you know of that is a "None Complete Dry Out" WS flux? I would love to know.
I deal with loads of quick turn proto and short runs. Holding a placed job before reflow is important.
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Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
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Use the form below to submit a comment.
The big problem was cleaning a board after rework, you can not remove the no clean flux, it makes a mess. So we gave up and used WS, late parts became hand soldered parts.
Is there anything out there that you know of that is a "None Complete Dry Out" WS flux? I would love to know.
I deal with loads of quick turn proto and short runs. Holding a placed job before reflow is important.
Bob Kondner