Brian O'Leary, General Manager of International Sales, KIC
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Mark McMeen, VP Engineering Services, STI Electronics Inc.
Neil O'Brien, Sales Director, Finetech
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We have tried the BGA replacement two to three times on the same PCB. And we found it reliable. The only thing that is to be considered to have proper removal of BGA in order not to damage the PCB solder pads.
Maninder Singh, Deltron (A Division of CDIL), India
At my company we qualify PCB suppliers in part based on HATS or IST via reliability results. We specify 6 preconditioning cycles to simulate assembly processes. Our reliability test results, then, are only valid up to 6 thermal cycles.
As Mr. O'Brien points out, a board with one reflow cycle has margin for only one BGA replacement. So we limit our assembly suppliers to 6 thermal cycles at any one site, but only one BGA replacement.
Jimmie King, GE Healthcare
All depend of the board finished. We are using AgIm and ENIG-Au/Ni we reworked Ceramic BGA's three times on AgIm boards and five times on ENIG-Au/Ni finished. The BGA removal profile is crucial in order to not damage or burn the PCB lands.
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner. IPC — Association Connecting Electronics Industries
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit. CircuitMedic
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
Use the form below to submit a comment.
Maninder Singh, Deltron (A Division of CDIL), India
As Mr. O'Brien points out, a board with one reflow cycle has margin for only one BGA replacement. So we limit our assembly suppliers to 6 thermal cycles at any one site, but only one BGA replacement.
Jimmie King, GE Healthcare
Sergio Ilescas Hernandez, Arris Group de Mexico