|
The Knowledge and Know-how Connection
|
|
May 21, 2012
|
|
|
|
|
|
More Related Programs »
More Ask the Experts »
|
Reflow Solder Process Issue
What conditions would be creating a "solder robbing" issue with our reflow process? Is it related to temperature uniformity?
We have a "solder robbing" issue with our reflow process. We feel it is related to the temperature uniformity of the reflow oven?
Are there other conditions that would create this problem?
Q.N.
Expert's Panel Responses
To minimize the occurrences of solder robbing during reflow, the profile should be modified to have a longer low temperature soak time to drive off the lower boiling point volatiles.
Additionally, the boards could be reflowed in an inert atmosphere to preventany additional oxidation. The nitrogen level should be between 20 to 200 ppm of oxygen.
Terry Jeglum
President/CEO, Electronic Technology Corporation
Mr. Jeglum has 35+ years experience and is the founder of Electronic Technology Corporation. He is responsible for 22 years of program management for the Company.
|
|
Why do you believe it is related to temperature uniformity?
Typical drivers for solder robbing is overprinting or slump of the solder paste. Is this under a BGA?
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
|
|
|
Today's Sponsor
|
|
IPC Member Spotlight
»
|
New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems 
|
|
Featured Sponsors
»
|
LPKF ZelFlex Reusable Stencil Frame System
LPKF ZelFlex is a reusable stencil frame system that saves cost, reduces storage space and eliminates waste.
LPKF Laser & Electronics 
|
Cost-effective, Hybrid Heating Rework System
Unique rework station combines IR radiation & convection heating. Large area bottom heater for temperature uniformity & camera driven alignment for error-free accuracy.
Martin 
|
Time for an upgrade?
ECD's thermal profiler has 1.5 million data points, onboard T/C readiness & internal storage of up to 96 profiles. It's the Smartest Profiler on the Planet.
ECD 
|
Benefits of Electrolytic Solder
The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
Metallic Resources, Inc. 
|
New Standards in Dispensing Technology
The new Scorpion can dispense up to 100,000 dots per hour. The ideal dispensing system for flexible and productive dispensing.
Essemtec 
|
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK 
|
|
|
|
|
Views: 665
|
Use the form below to submit a comment.
No comments have been submitted.