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February 10, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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Reflow Solder Process Issue
Reflow Solder Process Issue
What conditions would be creating a "solder robbing" issue with our reflow process? Is it related to temperature uniformity?
This program first published September 2009
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Expert Panel contributors for this topic:
Dr. Craig D. Hillman, CEO & Managing Partner, DfR Solutions
Terry Jeglum, President/CEO, Electronic Technology Corporation
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