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February 10, 2012
Cleaning Reballed BGA Components
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Rework for Lead-Free Mirrored BGA Designs
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Is Pre-Bake Required Prior to Rework?
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BGA Replacement Limit
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6 Common Mistakes of BGA Rework
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Can You Rework Circuits Under a BGA
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Reworked BGA Bridging at the Corners
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Delamination Dilemma
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BGA Re-balling from Lead-free to Tin-lead
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Reworking Circuits Under a BGA Component
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Great News If You Rework BGA Components
Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
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Is Pre-Bake Required Prior to Rework?
Is Pre-Bake Required Prior to Rework?
On occasion we need to perform rework. Is there a standard that can be applied for pre-bake requirements prior to rework?
This program first published September 2009
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
EH Lim, Managing Director, Asia Pacific, ECD
Ken Bliss, President & CEO, Bliss Industries, Inc.
James Mahoney, Applications Project Manager, Quick Turn Flex Circuits LLC
Prashant Joshi, Director of Engineering, Interconnect Systems Inc.
Don Naugler, General Manager, VJ Technologies, Inc.
Mark McMeen, VP Engineering Services, STI Electronics Inc.
Neil O'Brien, Sales Director, Finetech
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