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February 10, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
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Cause of Defective Solder Joints
Cause of Defective Solder Joints
What is the possible cause of incomplete soldering after surface mount reflow? The circuit boards in question are HASL.
This program first published September 2009
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  »
Use the form below to submit a comment.
The yellow stain is usually Sn oxide, which is a cosmetic issue (it does not impact the solderability). Problems with solderability on HASL pads are usually cuased by the hot air knives in the HASL machine stripping the solder too thin, leaving exposed intermetallics which will not wet well. Check the solder deposit thickness to make sure their is "free" solder above the intermetallics on the pad.

Wallace Ables, Dell
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Cause of Defective Solder Joints

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