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The Knowledge and Know-how Connection
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May 17, 2012
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Authored By:
Zarrow Hall
This program first published September 2009
Board Talk programs are presented by:Phil Zarrow, ITM ConsultingWith over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes. Jim Hall, ITM ConsultingA Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Use the form below to submit a comment.
Then we limit our assemblers to 6 thermal cycles at any one site. Thus we maintain the validity of the reliability qualification.
Jimmie King, GE Healthcare
Too much Z axis movement and the interconnects separate from the barrel and the pads rise breaking the "knee" of the hole wall/pad interface. The only way to understand the limits for your own process is to perform DOE's and destructive analysis as part of the validation of the reflow and rework processes.
Too often CCA assemblers are enthusiastic about throwing the PWB supplier under the bus and unwilling to examine their own processes. I have been on both sides of the business.
Brad Fern, Logic
Michael Nadreau
Keep up the program very informative.
Randy Bock
Dan Pereira, GBE