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The Knowledge and Know-how Connection
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June 18, 2013
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Views: 5682
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Here are the results of the RIT study in a nutshell. The results confirm much of what Phil and Jim have been saying. I was somewhat surprised that aluminum tape clearly beat out Kapton "thermally" aside from the obviously problem a TC has staying in place with Kapton as we all know when we see saw tooth zig-zagging of TC readings.
I was really surprised high temp solder performed so poorly! After this study I don't really see a situation where it should ever be used?
Supporting evidence can be found at the following link ahead of a formal publishing of the data.
http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/
Brian O'Leary, KIC
Hey guys, great response to your earlier session. I posted on my blog comments to this discussion at: http://profilingguru.com/reflow/measure/thermocouple-attachment-discussion/
I have a link to a conference paper that studied all of these different materials for TC attachment, included in the blog, but it is 10 years old. Currently RIT is re-conducting a similar study to test if our findings are still up-to-date.
Hope to have some results by SMTAI. Great stuff again, love it! Hey you guys ever think about a Podcast? Wouldn't mind taking both recordings and adding to my profiling guru podcast.
Brian O'Leary, KIC