Phil Zarrow, ITM Consulting With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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Here are the results of the RIT study in a nutshell. The results confirm much of what Phil and Jim have been saying. I was somewhat surprised that aluminum tape clearly beat out Kapton "thermally" aside from the obviously problem a TC has staying in place with Kapton as we all know when we see saw tooth zig-zagging of TC readings.
I was really surprised high temp solder performed so poorly! After this study I don't really see a situation where it should ever be used?
Supporting evidence can be found at the following link ahead of a formal publishing of the data.
I have a link to a conference paper that studied all of these different materials for TC attachment, included in the blog, but it is 10 years old. Currently RIT is re-conducting a similar study to test if our findings are still up-to-date.
Hope to have some results by SMTAI. Great stuff again, love it! Hey you guys ever think about a Podcast? Wouldn't mind taking both recordings and adding to my profiling guru podcast.
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Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications. Henkel Corporation
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
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Sandy Gentry, Editor | Kim Sterling, Publisher
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I was really surprised high temp solder performed so poorly! After this study I don't really see a situation where it should ever be used?
Supporting evidence can be found at the following link ahead of a formal publishing of the data.
http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/
Brian O'Leary, KIC
I have a link to a conference paper that studied all of these different materials for TC attachment, included in the blog, but it is 10 years old. Currently RIT is re-conducting a similar study to test if our findings are still up-to-date.
Hope to have some results by SMTAI. Great stuff again, love it! Hey you guys ever think about a Podcast? Wouldn't mind taking both recordings and adding to my profiling guru podcast.
Brian O'Leary, KIC