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February 10, 2012
False Tin Whiskers: Masquerading Intermetallic
Analysis Lab
Cause of Unusual Contamination?
Ask the Experts
Addressing Head-In-Pillow Defects
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What Causes Oxidation on SMT Pads?
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The Effects of Flux Residues on Reliability
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Head and Pillow SMT Failure Modes
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Elimination of Whiskers from Electroplated Tin
Materials Tech
Fracture Prediction in Lead-Free Joints
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Mysterious Solder Balls
Ask the Experts
Reducing Defects with Embedded Sensing
Materials Tech
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False Tin Whiskers: Masquerading Intermetallic
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering ...
pH Neutral vs. Alkaline Cleaning Agents
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies ...
Reactions of Sn in the Cu-Sn-Zn Alloy
This paper reports a number of experimentally determined reactions that occur in ...
Embedded Components: Analysis of Reliability
Paper aims at analyzing and confirming the reliability performance of embedded components ...
Lead-free Reflow and Influence of Moisture
This paper examines concerns relating to lead-free reflow, PCB degradation, and the ...
Thermal Cycle Testing of PWBs
Paper establishes a test protocol for thermal cycle testing of bare PWBs ...
Void Detection in Solder Balls and Joints
Paper covers an automatic void detection algorithm. The method is applicable to ...
Addressing Head-In-Pillow Defects
The head-in-pillow defect has become a relatively common failure since the implementation ...
Thermal Shock/Drop Test of Lead-free
Paper has results from experimental research making a comparison of different lead-free ...
The Effects of Flux Residues on Reliability
Paper discusses an experiment designed to mimic partially activated flux residues under ...
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Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America

Pockets of Contamination
Pockets of Contamination
This paper covers techniques for investigating pockets of contamination using a localized extraction method.
Authored By:
Eric Camden
Foresite, Inc.
Kokomo, IN USA
This program first published September 2009
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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The Design Process Just Got Easier
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The Design Process Just Got Easier
The Design Process Just Got Easier
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APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
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Flux and Under-fill in a Single Material
Flux and Under-fill in a Single Material
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
Henkel Corporation
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
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