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February 3, 2012
Improve Scheduling in Electronics Assembly
Supply Chain
Solder Paste and the 5 Ball Rule
Board Talk
Past, Present, Future of Solderless Assembly
Production Floor
Optimization to Prevent the Graping Effect
Production Floor
Stencil Manufacturing and Impact on Precision
Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Ask the Experts
A Robust Fine Feature Printing Process
Production Floor
When Is It Time to Replace a Squeegee or Stencil?
Board Talk
Pick and Place to Insert Radial Lead Devices
Board Talk
Optimizing Print Process for Mixed Technology
Production Floor
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The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits

Estimating Stencil Life
Estimating Stencil Life
This paper discusses the technique used to predict how long solder paste can be left on the stencil before it dries out.
Authored By:
Gerjan Diepstraten, Dr. Di Wu
Cobar Europe B.V.
Breda, The Netherlands
This program first published September 2009
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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New High-speed Modular Chip-shooter
New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
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APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
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Surface Mount and BGA Pad Repair... Really?
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Flux and Under-fill in a Single Material
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This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
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Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
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The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
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