Dr. David Bernard, Product Manager, Dage Precision Industries
Bill Coleman, Vice President Technology, Photo Stencil
Clive Ashmore, Global Process Manager, Dek Printing Machine
Joe Karcewski, Product Manager, APS-Novastar, LLC
Brian Smith, General Manager - Electronic Assembly Americas, DEK
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There are numerous tradeoffs to consider when pin in paste hole fill is the goal. First, overprinting can be problematic due to the possibility of mid chip solder balls. Step stencils are more expensive than standard stencils, and will likely result in reduced throughput and material expense due to the need to increase underwipe frequency.
One technology which is becoming very popular is the use of solder preforms in tape and reel packaging. The preforms come in standard sizes, such as 0402, 0603 and 0805 to name a few. They are packaged exactly like chip capacitors and resistors.
Placement is done after paste printing. Only 20-25% of the preform needs to contact the solder paste. Since the preform is solid metal, a preform as large as four times the volume of the paste volume can be added and still achieve perfect reflow results.
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit. CircuitMedic
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
Use the form below to submit a comment.
One technology which is becoming very popular is the use of solder preforms in tape and reel packaging. The preforms come in standard sizes, such as 0402, 0603 and 0805 to name a few. They are packaged exactly like chip capacitors and resistors.
Placement is done after paste printing. Only 20-25% of the preform needs to contact the solder paste. Since the preform is solid metal, a preform as large as four times the volume of the paste volume can be added and still achieve perfect reflow results.
Paul Koep, Cookson Electronics