IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 10, 2012
Improve Scheduling in Electronics Assembly
Supply Chain
Solder Paste and the 5 Ball Rule
Board Talk
Past, Present, Future of Solderless Assembly
Production Floor
Optimization to Prevent the Graping Effect
Production Floor
Stencil Manufacturing and Impact on Precision
Production Floor
Plating Lead-free Parts for Tin/Lead Assembly
Ask the Experts
A Robust Fine Feature Printing Process
Production Floor
When Is It Time to Replace a Squeegee or Stencil?
Board Talk
Pick and Place to Insert Radial Lead Devices
Board Talk
Optimizing Print Process for Mixed Technology
Production Floor
More Related Programs  »



Epoxy Bonding Problems on RoHS Boards
We are having problems with epoxy bonding to RoHS boards. Is there ...
Ultrasonic Cleaning Causing Damage
What method can be used to prevent damage to sensitive SMT components ...
Solder Deposits During Wave Soldering
During wave soldering, is there a possibility for solder to deposit on ...
Problems Hand Soldering 24 Layer Board
We are assembling a back plane board with 24 layers. We are ...
Component Damage From IR Reflow
We have an SMT package with J formed leads that crack at ...
Organic Flux Residue Concerns
What concerns should we have with reliability if we skip cleaning after ...
Alternatives to Conformal Coating
What are conformal coating alternatives to insulate solder joints and exposed conductors ...
Does Lead-free Flux Make a Difference?
Does using a lead-free solder flux really make a difference? Why not ...
Cause of Unusual Contamination?
We have 40 PCB assemblies with unusual contamination. Do you have any ...
Wave Soldering Problems
We are seeing many process defects that occur after wave soldering operations. ...
More Ask the Experts  »
Great News If You Rework BGA Components
Great News If You Rework BGA Components
Our unique BGA rework stencils have adhesive backing to seal around BGA pad to prevent solder paste bleed. Request a free sample.
CircuitMedic

Screen Print Shelf Life
Screen Print Shelf Life
What is the maximum allowable time for a PCB between screen printing and reflow? We are using a water soluble lead-free paste.
This program first published August 2009
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

Ask the Experts Questions | Ask the Experts Panel
Submit A Questions | Join the Panel
Expert Panel contributors for this topic:
John Vivari, Application Engineering Supervisor, Nordson EFD
Greg York, Technical Sales Manager, BLT Circuit Services Ltd
Clive Ashmore, Global Process Manager, Dek Printing Machine
Mike Scimeca, President, FCT Assembly
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Comments  »
Use the form below to submit a comment.

No comments have been submitted.
Submit A Comment  »
This comment is about the program:
Screen Print Shelf Life

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
Featured Sponsors  »
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic image
Innovative No-clean, Halide-free Tacky Flux
Innovative No-clean, Halide-free Tacky Flux
Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications.
Henkel Corporation
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
Rigid Flex That is Built to Last
Rigid Flex That is Built to Last
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right.
Printed Circuits, Inc.
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships