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The Knowledge and Know-how Connection
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June 19, 2013
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Mike Scimeca, President, FCT Assembly | |
Edward Zamborsky, Regional Sales Manager, OK International Inc. |
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Views: 5456
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I am correct to say that the temperature and humidity recommended here is more for assembly done using reflow process where paste is involved? What about manual soldering where solder wire, flux and soldering irons are used? Will the temperature and humidity values be the same?
Wee Mei, DSO National Laboratories