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June 19, 2013
Low Surface Energy Coatings, Rewrites the Area Ratio Rules
Low Surface Energy Coatings, Rewrites the Area Ratio Rules
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Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
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Big Ideas on Miniaturization
Big Ideas on Miniaturization
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Sources of ESD in a Production Line
Sources of ESD in a Production Line
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Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
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Advanced Second Level Assembly Analysis Techniques
Advanced Second Level Assembly Analysis Techniques
Analysis Lab
Solder Paste Life on the Stencil
Solder Paste Life on the Stencil
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Printing vs. Dispensing
Printing vs. Dispensing
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Step Stencil Design for Handheld
Step Stencil Design for Handheld
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Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
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What Is the Ideal Humidity for PCB Assembly?
What Is the Ideal Humidity for PCB Assembly?
How would the temperature and humidity differing from the recommended affect the solderability of circuit board assemblies?
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Expert Panel contributors for this topic:
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Mike Scimeca, President, FCT Assembly
Edward Zamborsky, Regional Sales Manager, OK International Inc.
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I am correct to say that the temperature and humidity recommended here is more for assembly done using reflow process where paste is involved? What about manual soldering where solder wire, flux and soldering irons are used? Will the temperature and humidity values be the same?

Wee Mei, DSO National Laboratories

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