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February 9, 2012
Hot Air Solder Leveling in the Lead-free Era
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Embedded Components: Analysis of Reliability
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The Demise of the Plated-Through Hole?
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Improve Etching Performance
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Removal of Oxidation from Bare PCBs
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Poor Wetting On OSP Coated PCBs
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Board Performance after Pb-Free Reflow
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Lead-free Board Materials Reliability Project
Materials Tech
Emerging Substrate Technologies
Materials Tech
Effect of Lead-Free on Key Material Properties
Materials Tech
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Shiny or Matte Solder Resist?
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This program first published August 2009
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Steven Adamson, Market Specialist, Nordson ASYMTEK
Mike Scimeca, President, FCT Assembly
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