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February 10, 2012
Cleaning Reballed BGA Components
Board Talk
Rework for Lead-Free Mirrored BGA Designs
Production Floor
Is Pre-Bake Required Prior to Rework?
Ask the Experts
BGA Replacement Limit
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6 Common Mistakes of BGA Rework
Production Floor
Can You Rework Circuits Under a BGA
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Reworked BGA Bridging at the Corners
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Delamination Dilemma
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BGA Re-balling from Lead-free to Tin-lead
Production Floor
Reworking Circuits Under a BGA Component
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Printing Focused on Useful Technology
Printing Focused on Useful Technology
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Socket Rework Challenge
Socket Rework Challenge
What is the best way to rework a memory module socket with 220 leads. We consistently see warpage during localized reflow.
This program first published August 2009
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Neil O'Brien, Sales Director, Finetech
Don Naugler, General Manager, VJ Technologies, Inc.
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