The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime. Juki Automation Systems
Solder Joint Void Limit for BGA Components
What is a reject limit for BGA component solder joint voids in lead free class 2 and what can we do to reduce voids?
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier. Sunstone Circuits
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner. IPC — Association Connecting Electronics Industries
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit. CircuitMedic
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Once you have made the decision to package your electronics with rigid flex, it makes sense to pick a production partner who can build it right. Printed Circuits, Inc.
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601. Super Dry®
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015 Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
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