IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 10, 2012
Thermal Cycle Testing of PWBs
Analysis Lab
Void Detection in Solder Balls and Joints
Analysis Lab
Ideas for Identifying Counterfeit Components
Analysis Lab
2D and CT Scan X-ray for Joint Inspection
Analysis Lab
Combination of AOI and AVI Machines
Analysis Lab
Inspection to Improve Lead-Free Solder
Materials Tech
Test Optimization to Improve Rework
Analysis Lab
Flexible Fixturing System for In-Circuit Test
Production Floor
Guide to Understanding Your Testing Lab
Analysis Lab
NASA Lead-Free Project: Mechanical Shock Test
Analysis Lab
More Related Programs  »



Epoxy Bonding Problems on RoHS Boards
We are having problems with epoxy bonding to RoHS boards. Is there ...
Ultrasonic Cleaning Causing Damage
What method can be used to prevent damage to sensitive SMT components ...
Solder Deposits During Wave Soldering
During wave soldering, is there a possibility for solder to deposit on ...
Problems Hand Soldering 24 Layer Board
We are assembling a back plane board with 24 layers. We are ...
Component Damage From IR Reflow
We have an SMT package with J formed leads that crack at ...
Organic Flux Residue Concerns
What concerns should we have with reliability if we skip cleaning after ...
Alternatives to Conformal Coating
What are conformal coating alternatives to insulate solder joints and exposed conductors ...
Does Lead-free Flux Make a Difference?
Does using a lead-free solder flux really make a difference? Why not ...
Cause of Unusual Contamination?
We have 40 PCB assemblies with unusual contamination. Do you have any ...
Wave Soldering Problems
We are seeing many process defects that occur after wave soldering operations. ...
More Ask the Experts  »
PCB Protection Overview
PCB Protection Overview
Henkel's circuit board protection include, conformal coating, encapsulants, potting, module sealing and low pressure molding.
Henkel Electronics

Technology to Measure Oxidation Levels
Technology to Measure Oxidation Levels
Does technology to measure the level of oxidation on SMT pads exist? Can you quantify or categorize oxidation levels?
This program first published August 2009
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

Ask the Experts Questions | Ask the Experts Panel
Submit A Questions | Join the Panel
Expert Panel contributors for this topic:
Mark McMeen, VP Engineering Services, STI Electronics Inc.
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Mike Scimeca, President, FCT Assembly
Comments  »
Use the form below to submit a comment.
Yes, the technology exists. The technique is SERA (Sequential Electrochemical Reduction Analysis). The instrument is manufactured by ECI technology, based on the work of Dr. Morgan Tench. It works by using an electrolyte and applied current to reduce oxides. By monitoring the potential (voltage), current and time, the amount and type of oxides can be deduced.

There are limitations on the size and configuration of surfaces that can be tested, and a knowledgeable analyst is required to interpret the results.

For production testing, a more functional test is often used, that is, an actual soldering test. Bear in mind that a functional test has the advantage of being a direct indication of the effect on soldering performance, but has the disadvantage that it does not point to root cause. The analytical technique (SERA) has the advantage of pointing to root cause, but at the cost of not providing any direct information on how actual production soldering will be impacted.


Fritz Byle, Astronautics Corp.
Submit A Comment  »
This comment is about the program:
Technology to Measure Oxidation Levels

The is a general comment.
Your Name
Company
E-mail
Country
Comments
Discussion of pricing, recommendations for specific products or advertisements are not appropriate. All comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address, we request your email address so we can notify you if your comments are posted.
Today's Sponsor
Today's Sponsor
IPC Member Spotlight  »
The Design Process Just Got Easier
The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
Featured Sponsors  »
MSD Damage Causes Early Field Failures
MSD Damage Causes Early Field Failures
Components encapsulated in plastic or organic compounds are susceptible to moisture damage. So are PCBs, all can cause early field failures. Control MSDs per IPC J-Std-033b.1 and 1601.
Super Dry®
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
New High-speed Modular Chip-shooter
New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems
High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK image
The Component Counter Source
The Component Counter Source
SMD & through-hole types; others will tally 01005s. A must for inventory control, parts order checking or JIT production. From $389. MOTORIZED or MANUAL.
Manncorp
Printing Focused on Useful Technology
Printing Focused on Useful Technology
EKRA focuses on "Useful Technology" that provides real benefits characterized by their efficiency, ease-of-use, and reliability.
EKRA America
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships