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The Knowledge and Know-how Connection
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July 23, 2014
Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
Production Floor
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Production Floor
Type III vs. Type IV Solder Paste
Type III vs. Type IV Solder Paste
Ask the Experts
Screen Print Stepped Stencil Review
Screen Print Stepped Stencil Review
Board Talk
Effect of Nano-Coated Stencil on 01005 Printing
Effect of Nano-Coated Stencil on 01005 Printing
Production Floor
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Low Surface Energy Coatings Rewrite Area Ratio Rules
Low Surface Energy Coatings Rewrite Area Ratio Rules
Materials Tech
Printing vs. Dispensing
Printing vs. Dispensing
Board Talk
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
Quantifying Stencil Aperture Wall Quality
Quantifying Stencil Aperture Wall Quality
Analysis Lab
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Recommended Lead to Hole Ratio
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
Expert Panel contributors for this topic:
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Bill Coleman, Vice President Technology, Photo Stencil
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
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