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April 16, 2014
Most Important Factors for Screen Printing
Most Important Factors for Screen Printing
Ask the Experts
Minimizing Voiding in QFN Packages
Minimizing Voiding in QFN Packages
Production Floor
Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
Production Floor
How to Clamp Odd Shaped Circuit Boards
How to Clamp Odd Shaped Circuit Boards
Ask the Experts
Components Near PCB Edges
Components Near PCB Edges
Board Talk
Low-Silver BGA Assembly
Low-Silver BGA Assembly
Production Floor
Controlling the Assembly Process Using SPC
Controlling the Assembly Process Using SPC
Supply Chain
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
Board Talk
Choosing the Right Stencil Options
Choosing the Right Stencil Options
Production Floor
Chip Component Cracking During Pick/Place
Chip Component Cracking During Pick/Place
Board Talk
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Recommended Lead to Hole Ratio
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
Expert Panel contributors for this topic:
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Bill Coleman, Vice President Technology, Photo Stencil
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
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