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November 25, 2014
Solder Paste Stencil Design for Optimal QFN Reliability
Solder Paste Stencil Design for Optimal QFN Reliability
Production Floor
Screen Print Shelf Life
Screen Print Shelf Life
Ask the Experts
Nano Tech Improves Critical Printing Process
Nano Tech Improves Critical Printing Process
Production Floor
Solder Paste Print Volume vs. Alignment?
Solder Paste Print Volume vs. Alignment?
Board Talk
Reliability Study of Bottom Terminated Components
Reliability Study of Bottom Terminated Components
Analysis Lab
Advanced Printing for Microelectronic Packaging
Advanced Printing for Microelectronic Packaging
Production Floor
What Is Causing Sticky Stencil Blades?
What Is Causing Sticky Stencil Blades?
Ask the Experts
Printing of Solder Paste - A Quality Assurance Methodology
Printing of Solder Paste - A Quality Assurance Methodology
Production Floor
Solder Paste and the 5 Ball Rule
Solder Paste and the 5 Ball Rule
Board Talk
Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
Board Talk
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Recommended Lead to Hole Ratio
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
Expert Panel contributors for this topic:
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Bill Coleman, Vice President Technology, Photo Stencil
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
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