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October 31, 2014
Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
Board Talk
Reliability of Stacked Microvia
Reliability of Stacked Microvia
Production Floor
Problems With Starved
Problems With Starved "J" Lead Joints
Board Talk
Going Beyond Your Solder Paste Work Life?
Going Beyond Your Solder Paste Work Life?
Board Talk
Material Selection and Optimization for TMV PoP
Material Selection and Optimization for TMV PoP
Materials Tech
Sources of ESD in a Production Line
Sources of ESD in a Production Line
Production Floor
Cause of Damage During Through-hole Component Insertion
Cause of Damage During Through-hole Component Insertion
Board Talk
Stencil Manufacturing and Impact on Precision
Stencil Manufacturing and Impact on Precision
Production Floor
Effect of Squeegee Blades on Print Quality
Effect of Squeegee Blades on Print Quality
Production Floor
Guidelines for Pin-in-Paste
Guidelines for Pin-in-Paste
Ask the Experts
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Recommended Lead to Hole Ratio
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
Expert Panel contributors for this topic:
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Bill Coleman, Vice President Technology, Photo Stencil
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
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