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September 30, 2014
Stencil Manufacturing and Impact on Precision
Stencil Manufacturing and Impact on Precision
Production Floor
Effect of Squeegee Blades on Print Quality
Effect of Squeegee Blades on Print Quality
Production Floor
Guidelines for Pin-in-Paste
Guidelines for Pin-in-Paste
Ask the Experts
Advanced Second Level Assembly Analysis Techniques
Advanced Second Level Assembly Analysis Techniques
Analysis Lab
Solder Paste  Beyond The Shelf Life?
Solder Paste Beyond The Shelf Life?
Board Talk
What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Board Talk
Solder Paste Life on the Stencil
Solder Paste Life on the Stencil
Ask the Experts
Taking the LED Pick and Place Challenge
Taking the LED Pick and Place Challenge
Production Floor
Double Print Stencils Systems
Double Print Stencils Systems
Production Floor
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
Production Floor
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Recommended Lead to Hole Ratio
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
Expert Panel contributors for this topic:
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Bill Coleman, Vice President Technology, Photo Stencil
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
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