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February 10, 2012
Solderability Problems at Low Humidity
Board Talk
Component Damage From IR Reflow
Ask the Experts
Lead-free Reflow and Influence of Moisture
Analysis Lab
Going Lead Free with Vapor Phase Soldering
Production Floor
LGA/QFN Packages Floating During Reflow
Analysis Lab
What Causes Chip Blow Off During Reflow?
Board Talk
How To Eliminate Pesky Solder Balls?
Board Talk
Weight Limit for Double Sided Reflow of QFNs
Production Floor
IR or Vapor Phase for Prototypes
Board Talk
SMT Component Shift
Ask the Experts
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Reflow Oven Testing and Calibrating
Reflow Oven Testing and Calibrating
Is there a standard test board with specific pad and test point sizes we should use to test and calibrate our reflow ovens?
This program first published August 2009
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Brian O'Leary, General Manager of International Sales, KIC
Allen W. Duck, CEO, ATEK llc
Gregory Arslanian, Global Segment Manager, Air Products & Chemicals, Inc.
Richard Burke, National Sales Manager, Datapaq
Al Cabral, Product Development Manager, VJ Technologies, Inc.
John S. Wasyliw, VP of Engineering, APS Novastar LLC
Fred Dimock, Manager, Process Technology, BTU International
Grant Peterson, Vice President; Marketing & Sales, ECD
Comments  »
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After using your reflow oven for a certain time, when you get a bad profile do not always blame it on the recipe. Some times the reflow oven itself may be the cause and may need to be checked.

Fred Baker, DENSO, USA
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Reflow Oven Testing and Calibrating

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