Consistently reliable water soluble solder paste AIM WS488 water soluble solder paste meets industry demands for a consistently reliable water soluble product.
Videos and Programs
1 of 1
One-Step Underfill A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Videos
AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry. Our product line includes solder paste, liquid flux, bar solder, wire solder, solder preforms, adhesives, cleaners, chemicals, plating anodes and indium and gold alloys.
AIM's product line includes a wide variety of lead-free solder alloys. AIM offers manufacturing, distribution and support facilities located throughout the world.
