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February 10, 2012
Thermal Cycle Testing of PWBs
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Void Detection in Solder Balls and Joints
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Thermal Cycle Testing of PWBs
Thermal Cycle Testing of PWBs
Paper establishes a test protocol for thermal cycle testing of bare PWBs exposed to lead-free and rework simulation.
Authored By:
Mike Freda
Sun Microsystems

Paul Reid
PWB Interconnect Solutions
This program first published July 2009
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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