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February 10, 2012
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Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
This paper discusses the results of independent experiments to address aspects of successful Package on Package integration.
Authored By:
Brian Roggeman, Michael Meilunas
Unovis Solutions
Binghamton, NY USA
This program first published July 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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 Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
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