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February 8, 2012
Evaluation of Lead-free Solder Pastes
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Developing a New Lead-Free Alloy
Developing a New Lead-Free Alloy
This paper discusses the process for development of a new lead free alloy for high reliability, high temperature applications.
Authored By:
Hector Steen, Ph.D., Brian Toleno, Ph.D.
Henkel Corporation
This program first published July 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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