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February 10, 2012
Evaluation of Lead-free Solder Pastes
Materials Tech
Reactions of Sn in the Cu-Sn-Zn Alloy
Analysis Lab
Next Generation PoP Pastes
Materials Tech
Does Lead-free Flux Make a Difference?
Ask the Experts
The Digital Solder Paste
Materials Tech
Flux Cored Wire Solder Shelf Life Study
Materials Tech
Thermal Shock/Drop Test of Lead-free
Analysis Lab
Lead-free Development in Server Applications
Materials Tech
What is the Shelf Life of Solder Paste?
Board Talk
Comparison of SAC105 and SAC305 Solders
Materials Tech
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Long Term Reliability Analysis of Lead-free
Long Term Reliability Analysis of Lead-free
Paper covers a comparison of leaded assemblies and results obtained so far into the long term reliability study.
Authored By:
Gregory Morose, Sc.D., Toxics Use Reduction Institute (TURI),
Sammy Shina, Ph.D., University of Massachusetts
Bob Farrell and Paul Bodmer, Benchmark Electronics
Ken Degan, Teradyne Inc.
David Pinsky, Karen Ebner, and Amit Sarkhel, Raytheon Company
Richard Anderson Ph.D., and Helena Pasquito, Cobham
Michael Miller and Louis Feinstein, Textron Systems
Deb Fragoza, Eric Ren, EMC
Roger Benson, Carsem
Charlie Bickford, Wall Industries
This program first published July 2009
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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