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February 10, 2012
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More Production Floor  » 		High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK

SMT Process Characterization
SMT Process Characterization
The paper focuses on process capability and control and suggests that a process capability study should be a routine function.
Authored By:
Fan Li
Research In Motion
This program first published July 2009
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
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