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Authored By:
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This program first published July 2009
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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IPC Member Spotlight »
Ultimate Solution for Placement Flexibility
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Use the form below to submit a comment.
This helps assure the center area does not stand taller than the outside pads, as the solder gets wicked away, pulling the part downward as it cools. At least that has been my observation and my way to help produce consistent results, and to reduce trapped flux residues around the edges of a QFN package.
Andrew Perkins, Sr. Product Development Engineer, Datamatic, Ltd.