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February 3, 2012
Embedded Components: Analysis of Reliability
Analysis Lab
The Demise of the Plated-Through Hole?
Board Talk
Improve Etching Performance
Materials Tech
Removal of Oxidation from Bare PCBs
Board Talk
Poor Wetting On OSP Coated PCBs
Board Talk
Board Performance after Pb-Free Reflow
Materials Tech
Lead-free Board Materials Reliability Project
Materials Tech
Emerging Substrate Technologies
Materials Tech
Effect of Lead-Free on Key Material Properties
Materials Tech
Understanding Surface Insulation Resistance
Materials Tech
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Design of New Solder Attach Technologies
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Next Generation PoP Pastes
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Flux Cored Wire Solder Shelf Life Study
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Comparison of SAC105 and SAC305 Solders
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More Materials Tech  »
Unheard of Price for a Rework System
Unheard of Price for a Rework System
It's almost impossible to perform today's complex rework without split-vision. The Manncorp lead-free BR-710 desolders, removes and replaces BGAs and QFPs.
Manncorp

When Precision is Not Good Enough
When Precision is Not Good Enough
Papers shows that variations in pcb design can not be accounted for by look up tables and a more complex model is required.
Authored By:
Andrew Kelley
XACT PCB Ltd
North Shields, UK
This program first published June 2009
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
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Today's Sponsor
IPC Member Spotlight  »
Ultimate Solution for Placement Flexibility
Ultimate Solution for Placement Flexibility
The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market.
Juki Automation Systems, Inc.
Featured Sponsors  »
A Century of Global Soldering Leadership
A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
APEX EXPO® Keynote William Shatner
APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
Online PCB Repair Guidebook
Online PCB Repair Guidebook
Our guidebook should be helpful to anyone who works with bare boards and board assemblies. Dozens of procedures packed with illustrations.
Circuit Technology Center
Flux and Under-fill in a Single Material
Flux and Under-fill in a Single Material
This breakthrough epoxy flux material combines flux function and under-fill protection in a single material.
Henkel Corporation
Perfect Kit for Replating Gold Contacts
Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic image
High Speed Underfill & Coating in One System
High Speed Underfill & Coating in One System
The S-910 dispense platform enables high speed underfill of chip scale packages and precise coating onto moisture sensitive electronics.
Nordson ASYMTEK
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